Neuro-synaptic RAM; 3D photonic-electronic data link; complex memory management.
U.S. IC chemicals and materials; China export blacklist expands; global fab equipment report; high-density 3D DRAM; ...
More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.
A new technical paper titled “Analyzing Modern NVIDIA GPU cores” was published by Universitat Politècnica de Catalunya.
A new technical paper titled “Synaptic and neural behaviours in a standard silicon transistor” was published by researchers ...
Unveiling GPU Bottlenecks in Large-Batch LLM Inference” was published by researchers at Barcelona Supercomputing Center, ...
A new technical paper titled “Thermal Boundary Resistance Reduction by Interfacial Nanopatterning for GaN-on-Diamond ...
The EDA industry is about 50 years old, and I see the people responsible for its first generation setting their LinkedIn employment status to ‘retired, at home’ almost daily. I, for one, have a foot ...
Number of designs that are late increases. Rapidly rising complexity is the leading cause, but tools, training, and workflows ...
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