Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing technologies.

For today’s multi-kilowatt AI servers, 48 V therefore represents a practical intermediate point. It substantially reduces current compared with 12 V, remains compatible with modular rack-level power ...

Cleanova has acquired California-based SV Techsol, expanding its engineering and environmental control capabilities for semiconductor manufacturing and other ultra-clean applications.

The next decade of AI infrastructure will certainly require more compute. But according to Scalia, the real innovation will occur in the interconnected layers that power, manage and optimise it. And ...

Chipmakers can lower cost of test, factory floor space, and time to market for high-power AI, automotive, and other high-reliability devices. Teradyne has introduced a production-ready system that ...

With dies embedded directly into a silicon wafer, onsemi is targeting higher density, better thermal performance and tighter integration in AI and electric vehicle applications.