Abstract: III-V materials, such as InGaAs and InP, are highly attractive for high-performance electronics and optoelectronics owning to their high carrier mobilities and potential for bandgap ...

Global goods trade expanded in 2025, supported by strong demand for AI related products, relatively low shipping costs, and the ability of global value chains to adapt through trade diversion and ...

This book gives introductory chapters on the classical basic and standard methods for asymptotic analysis, such as Watson's lemma, Laplace's method, the saddle point and steepest descent methods, ...

Abstract: State-of-the-art silicon interposer technology of chip-on-wafer-on-substrate (CoWoS) containing the second-generation high bandwidth memory (HBM) has been applied for the first time in ...