A few hours before the inauguration of the Berlin ILA airshow, the German Chancellor unsurprisingly announced the end of the Future Combat Air System (FCAS). Launched by Emmanuel Macron and Angela ...

Dassault Systèmes, Quanta Cloud Technology, and Nvidia are advancing industrial digital twins for AI factories, a shift that could shape how companies worldwide build, run, and scale generative AI ...

"U.S. automaker Ford cut design and engineering work that used to take 40 hours to 4 hours by using AI-based simulation. Ultimately, by using AI, it will become possible to complete the same work in 4 ...

Months after its OpenAI deal fell through, Disney has found a new way to make use of AI. The company’s Imagineering Research & Development unit is using Adobe’s Firefly Foundry, the commercial version ...

As 120 Indian startups prepare to fly to France for Bharat Innovates 2026, one of the people watching them closely is convinced India's moment has arrived. In a conversation with Shradha Sharma, ...

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Anthropic announced enhancements to Claude Design on June 17, 2026. Claude Design now supports design system-aligned production, direct editing on the canvas, synchronization with Claude Code, and ...

Planned as Europe's biggest joint defence project, FCAS has been abandoned after French and German companies failed to resolve years of disputes, despite repeated political intervention. After months ...

Architect Marta Nowicka used an entirely reclaimed palette of scaffolding planks, hollow concrete blocks and wood-wool boards to bring a "gritty, unrefined" feel to this small studio in East Sussex.

Cryo-electron microscopy (cryo-EM) can help scientists determine the three-dimensional structure of proteins in unprecedented detail. Jacques Dubochet, former group leader at EMBL, shared the 2017 ...

Expand your understanding of spending and saving, discover your place in the economy and explore a world-class currency collection. Every five years, the Bank of Canada and the Government of Canada ...

As chiplet-based architectures gain traction across high-performance and cost-sensitive semiconductor applications, selecting the appropriate die-to-die interconnect standard has become a critical ...