COMSOL News 2026 Spotlights Innovations Driven by Multiphysics Simulation

The engineers and researchers highlighted in COMSOL News 2026 use COMSOL Multiphysics® to meet their development goals, push ...

Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions

Synopsys, Inc. (NASDAQ: SNPS) today announced availability of its first Multiphysics Fusion™ solutions for customer ...

Synopsys rolls out 'Multiphysics Fusion platform' for advanced AI chips

Synopsys ( SNPS) announced on June 17 the launch of its new Multiphysics Fusion platform, combining its AI-powered chip ...
Hosted on MSN

Electrifying Everything Will Require Multiphysics Modeling

A prototyping problem is emerging in today’s efforts to electrify everything. What works as a lab-bench mockup breaks in reality. Harnessing and safely storing energy at grid scale and in cars, trucks ...
New Electronics

Synopsys launches Multiphysics Fusion solutions to address advanced chip design complexity

Synopsys has introduced the first set of its Multiphysics Fusion solutions, aiming to help semiconductor designers manage the ...
EE World Online

Concurrent multiphysics analysis targets advanced node design escapes

Synopsys has released its first Multiphysics Fusion solutions, integrating Ansys golden signoff analysis directly into chip ...
Semiconductor Engineering

Automated Multiphysics For Successful 3D-IC Design

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...
Semiconductor Engineering

How Multiphysics Is Powering The Future Of 3D-ICs

It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already ...