It’s true that some designers prefer to buy controllers and PHYs separately, but many are asking IP vendors to provide pre-verified interface IP subsystems to reduce effort and time to market.
M31 Technology (M31), a global silicon intellectual property (IP) provider, today announced at the TSMC 2026 North America Technology Symposium that its eUSB2V2 interface IP has completed tapeout on ...
This white paper presents an overview of the I3C (Improved Inter-Integrated Circuit) IP, a cutting-edge communication interface designed to enhance sensor integration and streamline data exchange in ...
Modern embedded systems are becoming increasingly compact, power efficient, and feature rich. As SoCs integrate more functionality, developers need reliable debug access without increasing pin count ...
An efficient method of Packaging Silicon IP and then testing /synthesizing it for multiple configurations has been described. It has been shown how with the help of a packaging/regression environment ...
New D2D interface IP offers more than 3x bandwidth density of equivalent UCIe interface while requiring far less silicon Advanced power management capability automatically adapts to bursty data center ...
Marvell Technology, Inc. has claimed the industry’s first 2-nm 64 Gbits/s bi-directional die-to-die (D2D) interconnect, offering higher bandwidth and efficiency together with advanced power management ...
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